Infusion Epoxy System, Low Viscosity
Epoxy ResinEP-I20
Low-viscosity system with a long open time for even filling of large parts.
Cure range
20–80 °C68–176 °F
- Infusion
Resins & adhesives
High-strength resins with excellent chemical resistance, used for structural bonding in composite manufacturing.
| Compare | ||||||
|---|---|---|---|---|---|---|
![]() | 20–80 °C68–176 °F | Not suitable for Oven cureSuitable for Vacuum infusionNot suitable for Autoclave | 180min@25°C77°F | 250mPa·s@25°C77°F | ||
![]() | 80–140 °C176–284 °F | Suitable for Oven cureNot suitable for Vacuum infusionNot suitable for Autoclave | 6min@120°C248°F | 120mPa·s@60°C140°F |
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Low-viscosity system with a long open time for even filling of large parts.