Skip to content
Sencronom
TR · Türkçe
Back to product
Sencronom

Technical Data Sheet

SC-TDS-EP-H140 · Updated:

Heat-Cure Epoxy System

Resins & adhesives · Epoxy Resin

Heat-Cure Epoxy System

EP-H140

Heat-curing epoxy system for short-cycle molding.

Cures in the oven between 80 °C and 140 °C.

Manufacturing methods

Oven cure

SuitableSuitable for Oven cure

Vacuum infusion

Not suitable

Autoclave

Not suitable

Operating range

80–140 °C176–284 °F
03250122100212150302200392250 °C482 °F
Maximum service temperature
140 °C284 °F
Minimum service temperature
80 °C176 °F

Technical properties

PropertyValueUnit
Viscosity60 °C · mixed140 °F · mixed120mPa·s
Resin system compatibilityEpoxy
Process compatibilityOven cure
Gel time120 °C248 °F6min
Mix ratio (by weight)100 : 85

Notes

  • Storage conditions: 15–25 °C, in closed packaging59–77 °F, in closed packaging
  • Packaging: Resin 25 kg, hardener 21 kg