Technical Data Sheet
SC-TDS-EP-I20 · Updated:
Resins & adhesives · Epoxy Resin
Infusion Epoxy System, Low Viscosity
EP-I20
Low-viscosity system with a long open time for even filling of large parts.
Gels at room temperature, then post-cures at up to 80 °C.
Manufacturing methods
Oven cure
Not suitable
Vacuum infusion
SuitableSuitable for Vacuum infusionAutoclave
Not suitable
Operating range
20–80 °C68–176 °F
03250122100212150302200392250 °C482 °F
- Maximum service temperature
- 80 °C176 °F
- Minimum service temperature
- 20 °C68 °F
Technical properties
| Property | Value | Unit | Test method |
|---|---|---|---|
| Viscosity25 °C · mixed77 °F · mixed | 250 | mPa·s | ISO 12058 |
| Resin system compatibility | Epoxy | ||
| Process compatibility | Vacuum infusion | ||
| Gel time25 °C77 °F | 180 | min | |
| Mix ratio (by weight) | 100 : 30 | ||
| Recommended post-cure | 8 h, 60 °C8 h, 140 °F |
Notes
- Storage conditions: 15–25 °C, in closed packaging59–77 °F, in closed packaging
- Packaging: Resin 20 kg, hardener 6 kg
The temperature range is the lower and upper limit of the cure cycle.